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Editorial board

Darius Andriukaitis
Kaunas University of Technology, Lithuania

Alexander Argyros
The University of Sydney, Australia

Radu Arsinte
Technical University of Cluj Napoca, Romania

Ivan Baronak
Slovak University of Technology, Slovakia

Khosrow Behbehani
The University of Texas at Arlington, United States

Mohamed El Hachemi Benbouzid
University of Brest, France

Dalibor Biolek
University of Defence, Czech Republic

Klara Capova
University of Zilina, Slovakia

Erik Chromy
UPC Broadband Slovakia, Slovakia

Milan Dado
University of Zilina, Slovakia

Petr Drexler
Brno University of Technology, Czech Republic

Eva Gescheidtova
Brno University of Technology, Czech Republic

Ray-Guang Cheng
National Taiwan University of Science and Technology, Taiwan, Province of China

Gokhan Hakki Ilk
Ankara University, Turkey

Janusz Jezewski
Institute of Medical Technology and Equipment, Poland

Rene Kalus
VSB - Technical University of Ostrava, Czech Republic

Ivan Kasik
Academy of Sciences of the Czech Republic, Czech Republic

Jan Kohout
University of Defence, Czech Republic

Ondrej Krejcar
University of Hradec Kralove, Czech Republic

Miroslaw Luft
Technical University of Radom, Poland

Stanislav Marchevsky
Technical University of Kosice, Slovakia

Byung-Seo Kim
Hongik University, Korea

Valeriy Arkhin
Buryat State University, Russia

Rupak Kharel
University of Huddersfield, United Kingdom

Fayaz Hussain
Ton Duc Thang University, Vietnam

Peppino Fazio
Ca’ Foscari University of Venice, Italy

Fazel Mohammadi
University of New Haven, United States of America

Thang Trung Nguyen
Ton Duc Thang University, Vietnam

Le Anh Vu
Ton Duc Thang University, Vietnam

Miroslav Voznak
VSB - Technical University of Ostrava, Czech Republic

Zbigniew Leonowicz
Wroclaw University of Science and Technology, Poland

Wasiu Oyewole Popoola
The University of Edinburgh, United Kingdom

Yuriy S. Shmaliy
Guanajuato University, Mexico

Lorand Szabo
Technical University of Cluj Napoca, Romania

Tran Trung Duy
Posts and Telecommunications Institute of Technology, Ho Chi Minh City, Vietnam

Xingwang Li
Henan Polytechnic University, China

Huynh Van Van
Ton Duc Thang University, Vietnam

Lubos Rejfek
University of Pardubice, Czech Republic

Neeta Pandey
Delhi Technological University, India

Huynh The Thien
Ho Chi Minh City University of Technology and Education, Vietnam

Mauro Tropea
DIMES Department of University of Calabria, Italy

Gaojian Huang
Henan Polytechnic University, China

Nguyen Quang Sang
Ho Chi Minh City University of Transport, Vietnam

Anh-Tu Le
Ho Chi Minh City University of Transport, Vietnam

Phu Tran Tin
Ton Duc Thang University, Vietnam

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Foreword about Professor Miloslav Ohlidal member of the International Scientific Editorial Board of "Advances in Electrical and Electronic Engineering" journal and the Professor at Department of Optics and Precise Mechanics, Institute of Physical Engineering, Faculty of Mechanical Engineering, Brno University of Technology:

"The aim of the editorial policy of AEEE journal is to facilitate contacts between research centers and the industry within a wide range of scientific disciplines, including physics and optics. As a person who deals with optics of thin films, let me briefly mention here the importance of this discipline for the technological growth of our society. Generally, the use of these films is really multidisciplinary. For example, they serve as elements of various electronics systems, thin film coatings play important role in mechanical engineering, and their optical properties are utilized for example in optical, photovoltaic, automotive and jewelry industries. This fact is a powerful stimulant for the development of thin films with the new properties required by the above-mentioned technical practice. From another point of view, such new films also allow the creation of an unlimited variety of new advanced device structures which are developing in the academic research. Therefore, it is necessary to have reliable methods to characterize these properties. Regarding the films which are intended for optical applications, there are plenty of such methods determining the film optical parameters (today the number of them is certainly more than 100). Among them the variable angle spectroscopic ellipsometry (VASE) and spectrophotometry (SP) are the most often used. It is frequently valuable to combine those optical methods of thin film characterization with non-optical methods like, for example, scanning or transmission electron microscopy, scanning probe microscopy, energy dispersive X-ray spectroscopy etc. As a part of new trends in the field of thin films characterization can be mentioned trends characterized by an endeavor to include various film defects in the process of the evaluation of the film optical parameters. The development of imaging versions of VASE and SP can also be included in these trends"


Table of Contents

Electrical and Electronic Engineering

Fuzzy Sliding Mode Control Based on Backstepping Synthesis for Unmanned Quadrotors flash_logo_35
135 - 146
Interleaved DC/DC Boost Converter with Coupled Inductors flash_logo_35
147 - 154
Transient Fault Area Location and Fault Classification for Distribution Systems Based on Wavelet Transform and Adaptive Neuro-Fuzzy Inference System (ANFIS) flash_logo_35
155 - 166
Design of Multi-Nanoparticles Technique for Enhancing Magnetic Characterization of Power Transformers Cores flash_logo_35
167 - 177
Enabling D2D Transmission Mode with Energy Harvesting and Information Transfer in Heterogeneous Networks flash_logo_35
178 - 184
Gap Coupled Dual-Band Petal Shape Patch Antenna for WLAN / WiMAX Applications flash_logo_35
185 - 198
Design of an Open Hardware Bridge Between Robots and ROS/non-ROS Environments flash_logo_35
199 - 204
Regulated Electric Drainage and its Interference with Track Circuits flash_logo_35
205 - 210
Track Occupancy Detection Using Ratio of Open-Circuit Impedance to Short-Circuit Impedance flash_logo_35
211 - 217
Failure Analysis of Current and Future Electricity Meters and their Components in Relation to the Costs of Ownership flash_logo_35
218 - 225

Physics and Optics

Analysis of BDMOS and DTMOS Current Mirrors in 130 nm CMOS Technology flash_logo_35
226 - 232
3D Photonic Crystals for Direct Applications in Light Emitting Devices flash_logo_35
233 - 238
Electrodeposition of Cuprous Oxide on Boron Doped Diamond Electrodes flash_logo_35
239 - 245
Substrate Effect in Electron Beam Lithography flash_logo_35
246 - 252