Helpdesk

Top image

Editorial board

Darius Andriukaitis
Kaunas University of Technology, Lithuania

Alexander Argyros
The University of Sydney, Australia

Radu Arsinte
Technical University of Cluj Napoca, Romania

Ivan Baronak
Slovak University of Technology, Slovakia

Khosrow Behbehani
The University of Texas at Arlington, United States

Mohamed El Hachemi Benbouzid
University of Brest, France

Dalibor Biolek
University of Defence, Czech Republic

Klara Capova
University of Zilina, Slovakia

Erik Chromy
UPC Broadband Slovakia, Slovakia

Milan Dado
University of Zilina, Slovakia

Petr Drexler
Brno University of Technology, Czech Republic

Eva Gescheidtova
Brno University of Technology, Czech Republic

Ray-Guang Cheng
National Taiwan University of Science and Technology, Taiwan, Province of China

Gokhan Hakki Ilk
Ankara University, Turkey

Janusz Jezewski
Institute of Medical Technology and Equipment, Poland

Rene Kalus
VSB - Technical University of Ostrava, Czech Republic

Ivan Kasik
Academy of Sciences of the Czech Republic, Czech Republic

Jan Kohout
University of Defence, Czech Republic

Ondrej Krejcar
University of Hradec Kralove, Czech Republic

Miroslaw Luft
Technical University of Radom, Poland

Stanislav Marchevsky
Technical University of Kosice, Slovakia

Byung-Seo Kim
Hongik University, Korea

Valeriy Arkhin
Buryat State University, Russia

Rupak Kharel
University of Huddersfield, United Kingdom

Fayaz Hussain
Ton Duc Thang University, Vietnam

Peppino Fazio
Ca’ Foscari University of Venice, Italy

Fazel Mohammadi
University of New Haven, United States of America

Thang Trung Nguyen
Ton Duc Thang University, Vietnam

Le Anh Vu
Ton Duc Thang University, Vietnam

Miroslav Voznak
VSB - Technical University of Ostrava, Czech Republic

Zbigniew Leonowicz
Wroclaw University of Science and Technology, Poland

Wasiu Oyewole Popoola
The University of Edinburgh, United Kingdom

Yuriy S. Shmaliy
Guanajuato University, Mexico

Lorand Szabo
Technical University of Cluj Napoca, Romania

Tran Trung Duy
Posts and Telecommunications Institute of Technology, Ho Chi Minh City, Vietnam

Xingwang Li
Henan Polytechnic University, China

Huynh Van Van
Ton Duc Thang University, Vietnam

Lubos Rejfek
University of Pardubice, Czech Republic

Neeta Pandey
Delhi Technological University, India

Huynh The Thien
Ho Chi Minh City University of Technology and Education, Vietnam

Mauro Tropea
DIMES Department of University of Calabria, Italy

Gaojian Huang
Henan Polytechnic University, China

Nguyen Quang Sang
Ho Chi Minh City University of Transport, Vietnam

Anh-Tu Le
Ho Chi Minh City University of Transport, Vietnam

Phu Tran Tin
Ton Duc Thang University, Vietnam


Home Search Mail RSS


The Influence of Repetitive UIS on Electrical Properties of Advanced Automotive Power Transistors

Juraj Marek, Jozef Kozarik, Michal Minarik, Ales Chvala, Lubica Stuchlikova

DOI: 10.15598/aeee.v20i1.4120


Abstract

This paper investigates a degradation of three types of automotive power MOSFETs through repetitive Unclamped Inductive Switching (UIS) test typically used to evaluate the avalanche robustness of power devices. It is not uncommon in switching applications that greater than the planned voltage for voltage spikes can occur, so even the best electronic designs may encounter frequent avalanche events. Hence, there is a need to analyse the impact of repetitive avalanching on the electrical performance of power transistors. This article focused on the shift of main electrical parameters: on-resistance R_{ON}, breakdown voltage V_{BR}, threshold voltage V_{TH}, and corresponding characteristics, as well as capacitances. Analysis proved that DMOS transistors are less vulnerable to repetitive avalanching. The most impacted parameter was on-resistance R_{DSon}, where a 14 % increase was observed after 6 x 10^7 stress pulses. The parameters shift is attributed to hot carrier injection in the space charge region of blocking PN junction and involves mainly defects generation/activation in the drain side region of the gate oxide. For the TrenchMOS transistor, a significant shift of I-V curves was observed with considerable impact on the R_{ON} where an increase of 22 % was observed. The trench corner is verified to be the mainly degraded region by Synopsys Technology Computer Aided Design (TCAD) simulations. Degradation of drain-gate capacitance C_{DG} and input capacitance C_{in} was observed in all three types of analysed structures. DLTS was used to verify the generation/activation of defects invoked by stress. An increase of DLTS signal corresponding to energy levels of oxygen vacancies and impurities in SiO_2 and on interfaces were detected on stressed samples.

Keywords


Degradation; DLTS; repetitive avalanching; repetitive Unclamped Inductive Switching (UIS); TCAD.

Full Text:

PDF