Dear valued readers, esteemed authors, respected reviewers, and distinguished colleagues, We express our sincere gratitude for your unwavering support of the Advances in Electrical and Electronic Engineering (AEEE) journal. In a dedicated effort to enhance the overall quality of the journal, as well as to improve the experience for authors and reviewers engaged in the submission and review process for manuscripts submitted to the AEEE, we encourage you to explore the updated information available on the journal's website. It is our pleasure to announce that we will transition to a new submission platform on 15th March, 2024. We firmly believe that the innovative platform will provide a comprehensive and seamless experience for all stakeholders. Furthermore, to perpetuate the enhancements achieved through the implementation of the new platform and to fortify the quality of manuscript services, we wish to inform you that, effective from 15th March, 2024, manuscripts submitted and accepted will be subject to a mandatory Article Processing Charge (APC) of 250 euros. Transition period from now to 15th March, 2024: During the transition period, encompassing the period from now until 15th March, 2024, no changes will be implemented. Authors are welcome to submit their manuscripts, including both novel manuscripts and revised manuscripts, using the current platform, i.e., OJS. Additionally, decisions and comments will continue to be communicated through the existing platform during this timeframe. Commencing 15th March, 2024: Commencing 15th March, 2024, all review processes will transition to the novel platform, with the exception of manuscripts currently under review. The detailed instructions for each scenario are provided below : Guidelines for novel submission: To submit a novel manuscript, authors may adopt either of the following approaches: 1. Click Here - This direct link leads to the novel platform, Manuscript Manager. Please find below the attached file that provides instructions on creating an account on the novel platform, along with a step-by-step guide for submitting a novel manuscript. 2. Sign in to the AEEE website with your existing account (If you do not have an account yet, we kindly ask you to use the above approach.) On your profile home page (User home), click on [New submission]. This will also redirect you to the novel platform, Manuscript Manager. Please refer to the attached file for guidance on creating an account and submitting a novel manuscript. Guidelines for under review manuscript: All manuscripts currently under review will persist in utilizing the existing platform until a decision is rendered. In cases where the decision is Resubmit for Revise or Minor Revision, authors are required to incorporate the recommended changes from the reviewers and subsequently submit the revised manuscript using the novel platform. The guidelines for novel submission are provided above. Guidelines for the under-revision manuscript: Manuscripts under revision, such as those marked for Resubmit for Revise or Minor Revision, should be resubmitted via the novel platform. Authors are kindly requested to explicitly state in the cover letter during the resubmission process that their submission represents the revised version of the prior manuscript with the ID [Manuscript_ID]. The guidelines for novel submission are detailed above. This transition aims to streamline and enhance the submission and review processes for the AEEE journal. Your understanding and cooperation during this transition period are greatly appreciated. We deeply appreciate your ongoing support and cooperation. Please download the author guidelines Author Guidelines Kind regards, AEEE Editorial Board |
Editorial board
Darius Andriukaitis
Kaunas University of Technology, Lithuania
Alexander Argyros
The University of Sydney, Australia
Radu Arsinte
Technical University of Cluj Napoca, Romania
Ivan Baronak
Slovak University of Technology, Slovakia
Khosrow Behbehani
The University of Texas at Arlington, United States
Mohamed El Hachemi Benbouzid
University of Brest, France
Dalibor Biolek
University of Defence, Czech Republic
Klara Capova
University of Zilina, Slovakia
Erik Chromy
UPC Broadband Slovakia, Slovakia
Milan Dado
University of Zilina, Slovakia
Petr Drexler
Brno University of Technology, Czech Republic
Eva Gescheidtova
Brno University of Technology, Czech Republic
Ray-Guang Cheng
National Taiwan University of Science and Technology, Taiwan, Province of China
Gokhan Hakki Ilk
Ankara University, Turkey
Janusz Jezewski
Institute of Medical Technology and Equipment, Poland
Rene Kalus
VSB - Technical University of Ostrava, Czech Republic
Ivan Kasik
Academy of Sciences of the Czech Republic, Czech Republic
Jan Kohout
University of Defence, Czech Republic
Ondrej Krejcar
University of Hradec Kralove, Czech Republic
Miroslaw Luft
Technical University of Radom, Poland
Stanislav Marchevsky
Technical University of Kosice, Slovakia
Byung-Seo Kim
Hongik University, Korea
Valeriy Arkhin
Buryat State University, Russia
Rupak Kharel
University of Huddersfield, United Kingdom
Fayaz Hussain
Ton Duc Thang University, Vietnam
Peppino Fazio
Ca’ Foscari University of Venice, Italy
Fazel Mohammadi
University of New Haven, United States of America
Thang Trung Nguyen
Ton Duc Thang University, Vietnam
Le Anh Vu
Ton Duc Thang University, Vietnam
Miroslav Voznak
VSB - Technical University of Ostrava, Czech Republic
Zbigniew Leonowicz
Wroclaw University of Science and Technology, Poland
Wasiu Oyewole Popoola
The University of Edinburgh, United Kingdom
Yuriy S. Shmaliy
Guanajuato University, Mexico
Lorand Szabo
Technical University of Cluj Napoca, Romania
Tran Trung Duy
Posts and Telecommunications Institute of Technology, Ho Chi Minh City, Vietnam
Xingwang Li
Henan Polytechnic University, China
Huynh Van Van
Ton Duc Thang University, Vietnam
Lubos Rejfek
University of Pardubice, Czech Republic
Neeta Pandey
Delhi Technological University, India
Huynh The Thien
Ho Chi Minh City University of Technology and Education, Vietnam
Mauro Tropea
DIMES Department of University of Calabria, Italy
Gaojian Huang
Henan Polytechnic University, China
Nguyen Quang Sang
Ho Chi Minh City University of Transport, Vietnam
Anh-Tu Le
Ho Chi Minh City University of Transport, Vietnam
Phu Tran Tin
Ton Duc Thang University, Vietnam
User
Information
Abstracting/Indexing
FACTS AND FIGURES
- ISSN 1336-1376 (Print)
- ISSN 1804-3119 (Online)
- MK CR E 20146
- FREQUENCY: QUARTERLY (4 NUMBERS / YEAR) + SPECIAL ISSUES
- SJR: 0.202 (2021)
- SNIP: 0.342 (2021)
- CiteScore: 1.7 (2021)
- JCI: 0.17 (2021)
- AIS: 0.082 (2021)
- DOI Prefix: 10.15598
PUBLISHED BY
EDITORIAL STAFF
Nguyen Nhat Tan
Ton Duc Thang University, Vietnam
VSB-Technical University of Ostrava, Czech Republic
Tu Lam Thanh
Ton Duc Thang University, Vietnam
Tran Thanh Phuong
Ton Duc Thang University, Vietnam